Lid for a microelectronic package



FIG. 1 is a top plan view of a lid for a microelectronic package showing a first embodiment of my new design;

FIG. 2 is a side elevational view thereof, the opposite side being identical in appearance;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a bottom plan view of a lid for a microelectronic package showing a second embodiment of my new design, the only difference from the first embodiment residing in the appearance of the bottom. 

We claim the ornamental design for a lid for a microelectronic package, as shown and described. 